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IC Packaging Fair

IC Packaging Fair 2025

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Tuesday, October 28, 2025 - Oct 30, 2025  (3 days), Shenzhen ShiChina

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Overview

IC Packaging Fair
IC Packaging Fair

Date: from Oct 28, 2025 to Oct 30, 2025 (3 days)

Venue Shenzhen Convention and Exhibition CenterShenzhen ShiChina

Organizer RX (Reed Exhibitions)

Expected number of attendees : 70000

Expected number of exhibitors : 600

ICPF gathers domestic packaging and testing (P&T) factories, IDM brands with packaging and testing processes, and leading electronic manufacturing service buyers, with buyers' P&T products covering a full range of categories, including semiconductor integrated circuits, optoelectronic devices, power devices, and sensors. It comprehensively showcases advanced solutions for semiconductor packaging and testing throughout the entire process, including equipment and materials, to help exhibitors discover and develop new customers, expand into new tracks, and promote business cooperation between upstream and downstream in the packaging and testing segment, ultimately enhancing the overall manufact...uring strength of the domestic semiconductor packaging and testing industry. For more information, visit https://www.nepconasia.com/en-gb/bandaoti/ic-pack.html For exhibition inquiries, please contact Julia Gu at julia.gu@rxglobal.com (+86 21 2231 7010) or Bruce Xu at bruce.xu@rxglobal.com (+86 21 2231 7051) For marketing collaboration, please contact Caroline Ye at caroline.ye@rxglobal.com (+86-755-2383 4568) For visiting inquiries, please contact Walden Li at wadlen.li@rxglobal.com (+86 136-5125-1335)Read more

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