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Thin Wall Packaging Asia 2023
0 / 5
(0 opiniones)martes, 20 de junio de 2023 - 22 de jun de 2023 (3 días), United States, United States
Descripción general
Fecha: de 20 de jun de 2023 a 22 de jun de 2023 ( 3 días)
Evento Chicago, IL, USA, United States, United States
Número esperado de asistentes: 100
Número esperado de expositores: 25
The 3rd edition of AMI's Thin Wall Packaging Asia conference will take place on 25-26 September 2018 at the Banyan Tree Hotel, Bangkok, Thailand. AMI's Thin Wall Packaging Asia conference established itself as the leading must-attend event for lightweight plastic moulding industry in South East Asia, complementing AMI’s portfolio of specialist packaging conferences. Thin Wall Packaging Asia 2018, aimed at the value chain participants in the thermoformed and injection moulded packaging, is designed to help the industry get together to promote manufacturing excellence and new technology implementation. The growth of organised retail in Asia as well as more formalised approach to product br...anding will have a significant impact on packaging demand in the region. The industry is in need of a clearer definition to facilitate the change. The new requirements are expected to drive the development of fast-cycle lightweight packaging, barrier packaging for long-life products and packaging with superior decoration (IML). Thin wall plastic packaging like tubs, cups, pots, trays and clamshells, provides a means of supplying consumer appeal, convenience and product protection.Leer más
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