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IC Packaging Fair 2026
0 / 5
(0 reseñas)martes, 27 de octubre de 2026 - 29 de oct de 2026 (3 días), China, China
Resumen
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Fecha: del 27 de oct de 2026 al 29 de oct de 2026 (3 días)
Lugar Shenzhen Convention and Exhibition Center, China, China
Organizador RX (Reed Exhibitions)
Número estimado de asistentes: 70000
Número estimado de expositores: 600
ICPF gathers domestic packaging and testing (P&T) factories, IDM brands with packaging and testing processes, and leading electronic manufacturing service buyers, with buyers' P&T products covering a full range of categories, including semiconductor integrated circuits, optoelectronic devices, power devices, and sensors. It comprehensively showcases advanced solutions for semiconductor packaging and testing throughout the entire process, including equipment and materials, to help exhibitors discover and develop new customers, expand into new tracks, and promote business cooperation between upstream and downstream in the packaging and testing segment, ultimately enhancing the overall manufact...uring strength of the domestic semiconductor packaging and testing industry. For more information, visit https://www.nepconasia.com/en-gb/bandaoti/ic-pack.html For exhibition inquiries, please contact Julia Gu at julia.gu@rxglobal.com (+86 21 2231 7010) or Bruce Xu at bruce.xu@rxglobal.com (+86 21 2231 7051) For marketing collaboration, please contact Caroline Ye at caroline.ye@rxglobal.com (+86-755-2383 4568) For visiting inquiries, please contact Walden Li at wadlen.li@rxglobal.com (+86 136-5125-1335)Leer más
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